Dear Colleagues: USNCCM 2019 MS on "Advances and Applications in Meshfree and Particle Methods”

Dear Colleagues,

We cordially invite you to present your work in the thematic session “Advances and Applications in Meshfree and Particle Methods” as part of the 15th US National Congress on Computational Mechanics (USNCCM15) to be held July 28 - August 1, 2019 in Austin, Texas. The minisymposium is listed as MS# 301 on the submission website. Abstract submission is now open. To submit an abstract, please visit:

https://submissions15.usnccm.org/

Please be aware that the deadline for abstract submission is January 15th, 2019. Further details on the conference and abstract submission can be found at the conference website:

http://15.usnccm.org/

The goal of this minisymposium is to bring together experts working on these methods, share research results and identify the emergent needs towards more rapid progress in advancing the important fields of meshfree and particle methods. Topics of interest for this minisymposium include, but are not limited to the following:

• Recent advances in meshfree and particle methods, coupling of finite element and meshfree methods, smoothed particle hydrodynamics, and peridynamics
• Methods coupling multiple physics and/or multiple scales
• Methods of fictitious domains and non-intrusive coupling
• Strong form collocation methods
• Nodal integration and domain integration methods for the Galerkin formulation
• Characterization and stabilization of numerical instabilities
• Recent advances in modeling strong and weak discontinuities
• Recent advances in modeling extreme loading events
• Recent advances in modeling manufacturing problems
• Recent advances in modeling bio- and nano- mechanics problems
• Nonlocal mechanics and computation
• Parallel computation, solvers and large-scale simulations
• New applications

We look forward to receiving your abstract submission.

Best regards,

C.T. Wu
Livermore Software Technology Corporation, USA
ctwu@lstc.com

J. S. Chen
University of California, San Diego, USA
js-chen@ucsd.edu

Zhen Chen
University of Missouri, USA
ChenZh@missouri.edu

Sheng-Wei Chi
University of Illinois, USA
swchi@uic.edu

Mike Hillman
The Pennsylvania State University, USA
mhillman@psu.edu

Marc Alexander Schweitzer
University of Bonn and Fraunhofer SCAI, Germany
schweitzer@ins.uni-bonn.de

Dongdong Wang
Xiamen University, China
ddwang@xmu.edu.cn