Dear Colleagues:
We cordially invite you to present your work in the thematic session “Recent Advances and Applications in Meshfree and Particle Methods” as part of the 2019 International Mechanical Engineering Congress & Exposition (IMECE2019) to be held November 8-14, 2019 at Calvin L. Rampton Salt Palace Convention Center, Salt Lake City, Utah. The minisymposium is listed as 11-28 under Track 11: Mechanics of Solids, Structures and Fluids. Abstracts (presentation only) should be submitted by the deadline of July 22, 2019, at the IMECE 2019 website: https://event.asme.org/IMECE The aim of this minisymposium is to bring together experts working on these methods, share research results and identify the emergent needs towards more rapid progress in advancing the important fields of meshfree and particle methods. Topics of interest for this minisymposium include, but are not limited to the following: · Recent advances in meshfree, peridynamics, material point methods, and smoothed particle hydrodynamics · Recent advances in formulations for extreme material distortion, fragmentation, contact and impact, and material instability · Recent advances in numerical integration · Characterization and stabilization of numerical instabilities · Strong form collocation meshfree methods · Simulations involving multiple and coupled physics · Simulations involving multiple time and/or length scales · Simulation of multi-phase interactions · Simulation of structural responses to extreme loading · Simulation of microstructural behavior and microstructure evolution · Simulation of manufacturing processes · Simulation of bio and nano mechanics and material system responses · Applications of meshfree methods to simulation of natural disasters · Nonlocal mechanics and computation · New applications for which meshfree and particle methods are superior to conventional mesh-based methods · Parallel-computing, scalable algorithms, and large-scale simulations Organizers: Sheng-Wei Chi, University of Illinois, <[email protected]> J. S. Chen, University of California, San Diego, <[email protected]> Mike Hillman, Pennsylvania State University, <[email protected]> C. T. Wu, Livermore Software Technology Corporation, <[email protected]> https://www.asme.org/about-asme/news/asme-news/imece-2019-abstract-deadline-approaching
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