COMPLAS2021 - abstracts due April 9th

​Dear Colleagues,

We cordially invite you to present your work in the thematic session “Recent Advances in Meshfree, Particle, and Peridynamics Methods” as part of COMPLAS 2021 to be held September 7th-10th in Barcelona, Spain (if this is not possible due to COVID-19, the conference will be held online).

Abstract submission is open, the deadline to submit is April 9th.

To be able to submit an abstract, you have to first register for the conference here (no fee required at this time):

https://congress.cimne.com/complas2021/frontal/Registration.asp

After you register, you will need to log in and click on “submit your contribution”. The minisyposia is listed on the “Area / MS - IS” drop-down as “IS23 - Meshfree, Peridynamics, and Particle Methods: Contemporary Methods and Applications”.

Further details on the conference and abstract submission can be found at the conference website:
 
https://congress.cimne.com/complas2021
 
The goal of this minisymposium is to bring together experts working on these methods, share research results and identify the emergent needs towards more rapid progress in advancing the important fields of meshfree, peridynamic and particle methods. Topics of interest for this minisymposium include, but are not limited to the following:
 
• Fundamental developments
• Handling stationary and transient strong and weak discontinuities
• Formulations for extreme material distortion, fragmentation, contact and impact, and material instability
• Numerical integration
• Strong form collocation meshfree methods
• Rank stability, kernel stability, and other stability issues
• Simulation of classes of problems for which meshfree, peridynamics, and particle methods are superior to conventional mesh-based methods
• Parallel-computing, scalable algorithms, and large-scale simulations
• Multiple and coupled physics
• Multiple time and/or length scales
• Multi-phase (solid, fluid and gas) interactions
• Structural responses to extreme loading conditions such as blast, impact, and penetration
• Simulation of natural disasters like tsunamis, earthquakes, and landslides
• Simulation of manufacturing processes
• Simulation of bio and nano mechanics and material system responses

We look forward to receiving your abstract submission.

Best regards,

Mike Hillman
The Pennsylvania State University
[email protected]

J. S. Chen
University of California, San Diego, USA
[email protected]

John Foster
The University of Texas at Austin
[email protected]

Pablo Seleson
Oak Ridge National Laboratory
[email protected]