Michael C Hillman
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USNCCM16 - meshfree abstracts by Jan 15

1/5/2021

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Dear Colleagues,

We cordially invite you to present your work in the thematic session “Recent Advances and Applications in Meshfree and Particle Methods” as part of the 16th US National Congress on Computational Mechanics (USNCCM16) to be held July 25 - 29, 2021 in a hybrid format (virtual and physically in Chicago, Illinois - should the situation not allow in-person meeting, the congress will be 100% virtual).

The minisymposium is listed as MS# 406 on the submission website. Abstract submission is now open. To submit an abstract, please visit:http://16.usnccm.org/ab_sub

Please be aware that the deadline for abstract submission is January 15th, 2020. Further details on the conference and abstract submission can be found at the conference website:http://16.usnccm.org/

The goal of this minisymposium is to bring together experts working on these methods, share research results and identify the emergent needs towards more rapid progress in advancing the important fields of meshfree, peridynamic and particle methods. Topics of interest for this minisymposium include, but are not limited to the following:

  • Fundamental developments
  • Handling stationary and transient strong and weak discontinuities
  • Formulations for extreme material distortion, fragmentation, contact and impact, and material instability
  • Numerical integration
  • Strong form collocation meshfree methods
  • Rank stability, kernel stability, and other stability issues
  • Simulation of classes of problems for which meshfree, peridynamics, and particle methods are superior to conventional mesh-based methods
  • Parallel-computing, scalable algorithms, and large-scale simulations
  • Multiple and coupled physics
  • Multiple time and/or length scales
  • Multi-phase (solid, fluid and gas) interactions
  • Structural responses to extreme loading conditions such as blast, impact, and penetration
  • Simulation of natural disasters like tsunamis, earthquakes, and landslides
  • Simulation of manufacturing processes
  • Simulation of bio and nano mechanics and material system responses
​
We look forward to receiving your abstract submission.

Best regards,John Foster
The University of Texas at Austin
[email protected]

Mike Hillman
The Pennsylvania State University
[email protected]

J. S. Chen
University of California, San Diego, USA
[email protected]

Zhen Chen
University of Missouri, USA
[email protected]
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